Technical Introduction: "Bonding Silver Plating (High Brightness and Heat Dissipation Technology)"
Introducing bonding silver plating technology! Electroless silver plating is possible.
Sato-sen Co., Ltd. is capable of performing silver plating that can be deposited without electrolysis. We offer optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity, which can reduce discoloration due to thermal degradation during assembly and use. We provide reflector processing for high brightness and optimal surface treatment for LED wavelengths. We also propose various heat dissipation measures to lower the junction temperature of the chips. 【Features】 - Outline processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation is possible with heat sink pins inserted into through-holes. For more details, please contact us.
- Company：サトーセン
- Price：Other
